TGA2502 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2502' PDF : 10 Pages View PDF
TGA2502
TABLE IV
THERMAL INFORMATION
PARAMETER
TEST CONDITIONS
TCH
(°C)
θJC Thermal Resistance
(channel to Case)
Vd = 7 V
Id = 1.3 A
Pdiss = 9.1 W
123
θJC
(°C/W)
5.8
Tm
(HRS)
1.2E+7
Note: Assumes eutectic attach using 1.5 mil 80/20 AuSn mounted to a 20 mil CuMo
Carrier at 70oC baseplate temperature. Worst case condition with no RF applied, 100%
of DC power is dissipated.
Median Lifetime (Tm) vs. Channel Temperature
4
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