TGA2505 View Datasheet(PDF) - TriQuint Semiconductor

Part Name

Description

MFG CO.

TGA2505

13 - 17 GHz 2.5 Watt, 25dB Power Amplifier

TriQuint Semiconductor 

1 2 3 4 5 6 7 8 9 10

Mechanical Drawing

TGA2505

1.390 (0.055)

1.293 (0.051)

2

3

0.695 (0.027) 1

0.097 (0.004)

0.000 (0.000)

8

7

1.283 (0.051)

4

0.698 (0.027)

5

0.106 (0.004)

6

Units: millimeters (inches)

Thickness: 0.100 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

Bond pad #1

Bond pad #2

Bond pad #3

Bond pad #4

Bond pad #5

Bond pad #6

Bond pad #7

Bond pad #8

(RF Input)

(Vref)

(Vd3)

(Vd4)

(RF Output)

(Vdet)

(Vg4)

(Vg3)

0.100 x 0.200 (0.004 x 0.008)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.100 (0.004 x 0.004)

0.200 x 0.125 (0.008 x 0.005)

0.100 x 0.200 (0.004 x 0.008)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.100 (0.004 x 0.004)

9

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

May 2009 © Rev -

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