TGA2505 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2505' PDF : 12 Pages View PDF
Input TFN
TGA2505
Chip Assembly & Bonding Diagram
100pF
Vd
Off chip
R=10Ω
Off chip
C=0.1μF
Output TFN
Vg
Off chip
R=10Ω
Off chip
C=0.1μF
100pF
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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