TGA4506 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4506' PDF : 9 Pages View PDF
TGA4506
TABLE IV
THERMAL INFORMATION
PARAMETER
TEST CONDITIONS
TCH
(°C)
θJC Thermal Resistance
(channel to Case)
Vd = 3.5 V
Id = 60 mA
Pdiss = 0.21 W
98
θJC
(°C/W)
Tm
(HRS)
133
7.2E+6
Note: Assumes eutectic attach using 1.5 mil 80/20 AuSn mounted to a 20 mil CuMo Carrier
at 70°C baseplate temperature. Worst case condition with no RF applied, 100% of DC
power is dissipated.
Median Lifetime (Tm) vs. Channel Temperature
4
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