TGA4506 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4506' PDF : 10 Pages View PDF
Chip Assembly Diagram
Vg
TGA4506
RF In
RF Out
Vd
All three Vd pads (pad # 9, 10, 11 from mechanical drawing)
do not need to be connected
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
9
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
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