TGA4522 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4522' PDF : 12 Pages View PDF
TGA4522
Recommended Chip Assembly Diagram
Vg
15Ω
1.0μF
0.01μF
100pF
100pF
100pF
0.01μF
Vd
15Ω
1.0μF
TFN (10mil Alumina)
TFN (10mil Alumina)
Wedge bonds or ribbons
Vg
15Ω
1.0μF
0.01μF
100pF
100pF
100pF
0.01μF
Vd
15Ω
1.0μF
To reduce these components (0.01μF, 15Ω, 1.0μF) connect:
Vg @ bottom to Vg @ top
Vd @ bottom to Vd @ top
Bias Conditions: Vd = 6 V
Vg = ~ -0.6 V to get 400mA Id
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
11
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2009 © Rev -
Share Link: 
