TGA4542 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4542' PDF : 13 Pages View PDF
TGA4542
37 - 40 GHz 1W Power Amplifier
Product Compliance Information
ESD Information
Solderability
ESD Rating:
Value:
Test:
Standard:
Class 0
Passes 100V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Compatible with both lead-free (260 °C max.
reflow temp.) and tin/lead (245 °C max. reflow
temp.) soldering processes.
RoHS Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain
Hazardous Substances in Electrical and
Electronic Equipment).
This product also has the following attributes:
Lead Free
Halogen Free (Chlorine, Bromine)
Antimony Free
TBBP-A (C15H12Br402) Free
PFOS Free
SVHC Free
Assembly Notes
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment (i.e. epoxy) can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
• Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3-4 minutes,
maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Data Sheet: Rev - 9/15/12
© 2012 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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