TGA4953-SL View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA4953-SL' PDF : 19 Pages View PDF
Product Datasheet
Jan 4, 2012
TGA4953-SL
TABLE II
THERMAL INFORMATION
Parameter
Test Conditions
RΘJC Thermal Resistance
(Channel to Backside of
Package)
VD2T = 4.7V
ID2T = 150mA
PDISS = 0.71W
TBASE = 80°C
TCH
(°C)
RΘJC MTTF
(°C/W) (hrs)
98
26
>1E6
Note: Thermal transfer is conducted through the bottom of the TGA4953-SL
package into the motherboard. The motherboard must be designed to
assure adequate thermal transfer to the base plate.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 info-networks@tqs.com 3
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