TGA8014 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA8014' PDF : 6 Pages View PDF
Product Data Sheet
TGA8014-SCC
THERMAL INFORMATION
P ARAMETER
TE S T C O N D IT IO N N O M UN IT
RθJ C The rmal res is ta nc e (channe l to bac ks ide ) V+ = 8 V, I+ = 50% IDS S 30 °C/W
EQUIVALENT SCHEMATIC
RECOMMENDED
ASSEMBLY DIAGRAM
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RF connections: Bond two 1-mil diameter, 25-mil-length gold bond wires at both RF Input and RF Output
for optimum RF performance.
Close placement of external components is essential to stability.
Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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