TGA8286 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA8286' PDF : 7 Pages View PDF
RECOMMENDED
ASSEMBLY
DIAGRAM
Product Data Sheet
TGA8286-EPU
RF connections: Thermocompression bond using three 1-mil diameter, 20 to 30-mil-length gold bonds at
RF Input and at RF Output for optimum RF performance.
A 1uF, or greater, capacitor should be attached to the gate line within 1-2 cm of the 100pF bypass capacitor
for stability.
Close placement of external components is essential to stability.
Refer to TriQuint’s Recommended Assembly Instructions for GaAs Products.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed
during handling, assembly and test.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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