TGA8300 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA8300' PDF : 7 Pages View PDF
TYPICAL BIAS NETWORK
RECOMMENDED
ASSEMBLY DIAGRAM
TGA8300-SCC
V+= 6 V
Rd-Q
2
RF Input
1
3
TGA8300
CBlock
4
CBypass
RF Output
V- = -1 V
CBypass
V+
0.01 F
25
RF Input
RF Output
0.01 F
V-
RF connections: Bond using three 1- mil diameter, 20 to 30- mil-length gold bond wires at RF input and two 1 - mil
diameter, 20 to 30 - mil- length gold bond wires at RF output for optimum RF per formance.
Close placement of external components is essential to stability .
6
TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com
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