TGA8810-SCC View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA8810-SCC' PDF : 9 Pages View PDF
RECOMMENDED
ASSEMBLY DIAGRAM
TGA8810-SCC
VD2
68 pF
T.I.P.N. 3022039-1
~2.3nH
RF Input
RF Output
T.I.P.N. 3022039-1
~2.3nH
68 pF
VD1
RF connections: bond using two 1 -mil diameter, 20 to 25 -mil-length gold bond wir es at both RF Input and RF
Output for optimum RF per formance.
Close placement of exter nal components is essential to stability.
Bond using 0 .7-mil diameter wires on bond pads 7, 11, 13, and 14 since they ar e less than the .004 x .004
needed for 1-mil diameter wire.
Two on-chip to on -chip wire bonds are needed for bond pads 1, 2, 3, and 13.
6
TriQuint Semiconductor, Inc. • Texas Facilities • (972) 995-8465 • www.triquint.com
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