TGC1430F-EPU View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGC1430F-EPU' PDF : 4 Pages View PDF
Advance Product Information
June 29, 2004
TGC1430F-EPU
Recommended Assembly Drawing
RFin
RFout
Attach 2 TFNs and MMIC to carrier plate as
shown using conductive epoxy.
Bond 4 wires as shown using minimum length.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications subject to change without notice
3
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
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