TGF2021-08 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGF2021-08' PDF : 8 Pages View PDF
Mechanical Drawing
Product Datasheet
August 7, 2007
TGF2021-08
2.418 [0.095]
2.323 [0.091]
2.105 [0.083]
17
8
9
2.122 [0.084]
1.849 [0.073] 7
10
1.593 [0.063] 6
11
1.337 [0.053] 5
GATE
1.081 [0.043] 4
12
DRAIN
13
0.825 [0.032] 3
14
0.569 [0.022] 2
15
0.313 [0.012] 1
16 0.297 [0.012]
0.096 [0.004]
18
0.000 [0.000]
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond pads #1-8: (Gate) 0.090 x 0.090 (0.004 x 0.004)
Bond pads #9-16: (Drain) 0.090 x 0.090 (0.004 x 0.004)
Bond pad #17: (Vg*) 0.090 x 0.090 (0.004 x 0.004)
Bond pad #18: (Vg*) 0.090 x 0.090 (0.004 x 0.004)
*Note: Bond pads #17 & 18 are alternate gate pads
that can be used for paralleling FETs.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during
handing, assembly and test.
7
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