TGF4118 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGF4118' PDF : 9 Pages View PDF
Mechanical Drawing of TGF4118-EPU
81.0
(2.057)
76.3
(1.938)
65.3
(1.659)
48.8
(1.239)
32.2
(0.819)
15.7
(0.399)
4.7
(0.119)
0.0
Alternate gate pad
0.0
7.4
(0.187)
69.0
(1.753)
61.6
(1.565)
52.5
(1.333)
45.1
(1.145)
35.9
(0.913)
28.5
(0.725)
19.4
(0.493)
12.0
(0.305)
24.9
(0.632)
36.0
(0.914)
Alternate drain pad
Units: mils (mm)
Thickness: 4.0 (0.10)
Gate pad sizes are 4.0 x 4.0 (0.10 x 0.10)
Drain pad sizes are 4.7 x 14.5 (0.12 x 0.37)
A minimum of four gate bonds and eight drain
bonds is recommended for operation. Sources are
connected to backside metalization. Alternate gate
and drain pads are located on either end of the
FET for paralleling TGF4118-EPUs.
TriQuint Semiconductor Texas Phone: 972 994-8465 Fax 972 994-8504
Web: www.triquint.com 8
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