TGS2302 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGS2302' PDF : 9 Pages View PDF
Mechanical Drawing
TGS2302
1.630 [0.064]
1.447 [0.056]
1.118 [0.044]
TQS 2006
RC
A
RC
A
2
1
0.676 [0.026]
2.106 [0.082]
3
4
5
1.478 [0.058]
0.975 [0.038]
0.676 [0.026]
0.000 [0.000]
0.000 [0.000]
0.173 [0.007]
2.062 [0.080]
2.240 [0.087]
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
GND IS BACKSIDE OF MMIC
Bond pad #1
Bond pad #2
Bond pad #3
Bond pad #4
Bond pad #5
(RF Output A)
(RF Input)
(Icontrol-A)
(Icontrol-B)
(RF Output B)
0.193 x 0.243 (0.008 x 0.010)
0.243 x 0.193 (0.010 x 0.008)
0.105 x 0.132 (0.004 x 0.005)
0.105 x 0.132 (0.004 x 0.005)
0.193 x 0.243 (0.008 x 0.010)
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas: www.triquint.com Phone (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
7
May 2008
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