TGS2304-SCC View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGS2304-SCC' PDF : 18 Pages View PDF
Product Data Sheet
TGS2304-SCC
FUNCTION TABLE
LOW–LOS S P ATH
RF Input to RF Output 0
RF Input to RF Output 1
RF Input to RF Output 2
RF Input to RF Output 3
R F INP UT
0V
0V
0V
0V
RF OUTP UT 0
-10 mA
10 mA
10 mA
10 mA
RF OUTP UT 1 RF OUTP UT 2 R F OUTP UT 3
10 mA
10 mA
10 mA
-10 mA
10 mA
10 mA
10 mA
-10 mA
10 mA
10 mA
10 mA
-10 mA
TEST ASSEMBLY
DIAGRAM
RF connections: bond using three 1.0-mil diameter, 20 to 25-mil-length gold bond wires at both RF Input and RF
Output for optimum RF performance.
Close placement of external components is essential for resonant-free performance.
Refer to TriQuint’s Gallium Arsenide Products Designer’s Information, MMIC Assembly Procedures, on our
web site.
TriQuint Semiconductor Texas Phone: (972)994 8465 Fax: (972)994 8504 Web: www.triquint.com
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