TIP3055 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

TIP3055

COMPLEMENTARY SILICON POWER TRANSISTORS

STMicroelectronics 

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Package mechanical data

3 Package mechanical data

TIP2955 - TIP3055

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect . The category of second level interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The

maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an

ST trademark. ECOPACK specifications are available at : www.st.com

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