TIP33C View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TIP33C' PDF : 4 Pages View PDF
Package mechanical data
3 Package mechanical data
TIP34C
In order to meet environmental requirements, ST offers these devices in
ECOPACK® packages. These packages have a Lead-free second level
interconnect . The category of second level interconnect is marked on the package
and on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box
label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com
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