TISP3260F3DR View Datasheet(PDF) - Power Innovations
Part Name
Description
MFG CO.
'TISP3260F3DR' PDF : 17 Pages View PDF
TISP3240F3, TISP3260F3, TISP3290F3, TISP3320F3, TISP3380F3
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1994 - REVISED SEPTEMBER 1997
MECHANICAL DATA
P008
plastic dual-in-line package
This dual-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions The package is intended for
insertion in mounting-hole rows on 7,62 (0.300) centers. Once the leads are compressed and inserted,
sufficient tension is provided to secure the package in the board during soldering. Leads require no
additional cleaning or processing when used in soldered assembly.
P008
10,2 (0.400) MAX
8
7
6
5
Designation per JEDEC Std 30:
PDIP-T8
Index
Dot
1
2
3
4
1,78 (0.070) MAX
4 Places
CL
CL
7,87 (0.310)
7,37 (0.290)
T.P.
6,60 (0.260)
6,10 (0.240)
2,54 (0.100) T.P.
6 Places
(see Note A)
5,08 (0.200)
MAX
Seating
Plane
0,51 (0.020)
MIN
3,17 (0.125)
MIN
0,533 (0.021)
0,381 (0.015)
8 Places
105°
90°
8 Places
0,36 (0.014)
0,20 (0.008)
8 Places
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTE A: Each pin centerline is located within 0,25 (0.010) of its true longitudinal position
MDXXABA
PRODUCT INFORMATION
14
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