TNY255P View Datasheet(PDF) - Power Integrations, Inc
Part Name
Description
MFG CO.
'TNY255P' PDF : 19 Pages View PDF
TNY253/254/255
SMD-8 (G Package)
D S .004 (.10)
-E-
8
5
B
P
1
4
L
A
-D-
M
J1
J3
G08A
C
-F-
J4
α
J2 .010 (.25) M A S
DIM
Inches
mm
.420
.046 .060 .060 .046
Pin 1
.080
.086
.186
.286
Solder Pad Dimensions
K
.004 (.10)
G
H
A 0.367-0.387
B 0.240-0.260
C
0.125-0.145
G 0.004-0.012
H
0.036-0.044
J1 0.057-0.068
J2 0.048-0.053
J3 0.032-0.037
J4
0.007-0.011
K
0.010-0.012
L
0.100 BSC
M
0.030 (MIN)
P
0.372-0.388
α
0-8°
9.32-9.83
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
4. D, E and F are reference datums on the
molded body.
PI-2077-040110
Revision Notes
A
-
B
1. Leading edge blanking time (tLEB) typical and minimum values increased to improve design flexibility.
2. Minimum DRAIN supply current (IS1, IS2) eliminated as it has no design revelance.
1. Updated package reference.
C
2. Corrected VR1 in Figure 12.
3. Corrected storage temperature, θJA and θJC and updated nomenclature in parameter table.
4. Corrected spacing and font sizes in figures.
1. Corrected θJA for P/G package.
D 2. Updated DIP-8 and SMD-8 Package Drawings.
3. Figure 10 caption and text description modified.
E 1. Changed SOA limit.
16 Rev E
02/12
Date
02/99
07/01
04/03
02/12
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