Qdatasheet_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

TNY276GN View Datasheet(PDF) - Power Integrations, Inc

Part Name
Description
MFG CO.
'TNY276GN' PDF : 24 Pages View PDF
Prev 21 22 23 24
TNY274-280
-E-
.240 (6.10)
.260 (6.60)
Pin 1
-D-
.125 (3.18)
.145 (3.68)
.032 (.81)
.037 (.94)
SMD-8C
⊕ D S .004 (.10)
.372 (9.45)
.388 (9.86)
⊕ E S .010 (.25)
.137 (3.48)
.100 (2.54) (BSC) MINIMUM
.367 (9.32)
.387 (9.83)
.057 (1.45)
.068 (1.73)
(NOTE 5)
.046 .060 .060 .046
.086
.186
.286
.080
.420
Pin 1
Solder Pad Dimensions
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
3. Pin locations start with Pin 1,
and continue counter-clock-
wise to Pin 8 when viewed
from the top. Pin 3 is omitted.
4. Minimum metal to metal
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
package body.
6. D and E are referenced
datums on the package
body.
.048 (1.22)
.053 (1.35)
.009 (.23)
.004 (.10)
.012 (.30)
.004 (.10)
.036 (0.91)
.044 (1.12)
0°- 8°
G08C
PI-4015-013106
22 E
2/06
Share Link: GO URL

All Rights Reserved © qdatasheet.com  [ Privacy Policy ] [ Contact Us ]