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TNY376 View Datasheet(PDF) - Power Integrations, Inc

Part Name
Description
MFG CO.
'TNY376' PDF : 20 Pages View PDF
150
Scaling Factors:
120
TNY375 1.0
TNY376 1.33
TNY377 2.33
TNY378 3.67
90
TNY379 4.87
TNY380 7.33
60
30
0
0
200
400
600
DRAIN Voltage (V)
Figure 27. Drain Capacitance Power.
TNY375-380
1.2
1.0
0.8
0.6
0.4
0.2
0
-50 -25 0 25 50 75 100 125
Junction Temperature (°C)
Figure 28. Undervoltage Threshold vs. Temperature.
Part Ordering Information
TNY 378 P N
• TinySwitch Product Family
• Series Number
• Package Identifier
P
Plastic DIP-8C
• Pin Finish
N Pure Matte Tin (Pb-Free)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
-D-
.125 (3.18)
.145 (3.68)
-T-
SEATING
PLANE
.100 (2.54) BSC
⊕D S .004 (.10)
.367 (9.32)
.387 (9.83)
DIP-8C
.057 (1.45)
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.120 (3.05)
.140 (3.56)
.014 (.36)
.022 (.56)
.048 (1.22)
.053 (1.35)
.137 (3.48)
MINIMUM
⊕ T E D S .010 (.25) M
.008 (.20)
.015 (.38)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
P08C
PI-3933-100504
www.powerint.com
19
Rev. A 05/07
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