TPN3021 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TPN3021' PDF : 8 Pages View PDF
Package mechanical data
3
Package mechanical data
TPN3021
Table 6. SO-8 (Plastic) dimensions
DIMENSIONS
REF.
Millimetres
Inches
Min. Typ. Max. Min. Typ. Max.
A
1.75
0.069
a1 0.1
0.25 0.004
0.010
a2
1.65
0.065
b 0.35
0.48 0.014
0.019
b1 0.19
0.25 0.007
0.010
C 0.50
0.020
c1
45° (typ)
D 4.8
5.0 0.189
0.197
E 5.8
6.2 0.228
0.244
e
1.27
0.050
e3
3.81
0.150
F 3.8
4.0 0.15
0.157
L 0.4
1.27 0.016
0.050
M
0.6
0.024
S
8° (max)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
6/8
Rev 4
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