TS4851 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
TS4851
STMicroelectronics
'TS4851' PDF : 28 Pages View PDF
TS4851
6 Package Information
Flip-chip - 18 bumps: TS4851JT
Package Information
Pin out (top view)
7
R
OUT-
GND
L
OUT -
6
R
OUT +
L
OUT +
5
R
IN
VCC
DATA
4
L
IN
NC
3
PHONE
IN
VCC
ENB
SPKR
SPKR
2
OUT +
OUT -
1
BYPASS
GND
CLK
A
BC
DE
Note: The solder bumps are on the underside.
Marking (top view):
The following markings are present on the topside of the flip-chip:
l The ST logo.
l The part number: A51.
l A 3-digit date code: YWW.
l A dot marking the location of Pin1A.
E
A51
YWW
Symbol for
Lead-Free
24/28
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