TS4984FC View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS4984FC' PDF : 30 Pages View PDF
TS4984FC
Package Mechanical Data
Figure 74. Package mechanical data for 15-bump flip-chip
1.90 mm
2.40 mm
0.86mm
0.25m
m
0.5mm
∅ 0.3mm
60 µm Back coating *
600 µm
■ Die size: 2.40 x 1.90 mm ±30µm
■ Die height (including bumps): 600µm
■ Back Coating height (optional):
60µm±10µm
■ Bump Diameter: 315µm ±50µm
■ Bump Diameter Before Reflow:
300µm ±10µm
■ Bump Height: 250µm ±40µm
■ Die Height: 350µm ±20µm
■ Pitch: 500µm ±50µm
■ Coplanarity: 60µm max.
* Optional
Figure 75. Tape & Reel specification (top view)
4
1.5
1
A
8
1
A
Die size X + 70µm
4
All dimensions are in mm
User direction of feed
29/30
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