TS4990 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS4990' PDF : 33 Pages View PDF
Package information
5
Package information
TS4990
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
5.1
Flip-chip package information
Figure 65. Flip chip pinout (top view)
3
Vin+
VCC
STBY
2
VOUT1 GND
VOUT2
1
Vin-
GND
BYPASS
AB C
■ Balls are underneath
Figure 66. Marking (top view)
XXX
YWW
E
Symbol for
lead-free package
■ ST logo
■ Product and assembly code: XXX
A90 from Tours
90S from Shenzhen
■ Three-digit datecode: YWW
■ E symbol for lead-free only
■ The dot indicates pin A1
24/32
Share Link: 
