TS4990JT View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS4990JT' PDF : 6 Pages View PDF
TS4990IJT
TS4990
PIN OUT (top view)
6
7
Vin-
Vout1
Vin+
5
8
GND
GND
VCC
9
4
1
BYPASS
VOUT2
STBY
3
2
s Balls are underneath
PACKAGE MECHANICAL DATA
FLIP CHIP - 9 BUMPS
0.5mm
0.5mm
1.6mm
1.6mm
MARKING (top view)
250µm
YWW 4990
s ST Logo
s Part number 4990
s Three digits Datecode : YWW
s The dot is for marking pin 1
s Die size : (1.6mm ±10%) x (1.6mm ±10%)
s Die height (including bumps) : 600µm
±30µm
s Bumps diameter : 315µm ±15µm
s Pitch: 500µm ±10µm
600µm
5/6
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