TS514 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS514' PDF : 10 Pages View PDF
Package Mechanical Data
5 Package Mechanical Data
TS514 / TS514A
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com.
5.1 DIP14 Package
DIM.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
Plastic DIP-14 MECHANICAL DATA
MIN.
0.51
1.39
1.27
mm.
TYP
0.5
0.25
8.5
2.54
15.24
3.3
MAX.
1.65
20
7.1
5.1
2.54
MIN.
0.020
0.055
0.050
inch
TYP.
0.020
0.010
0.335
0.100
0.600
0.130
MAX.
0.065
0.787
0.280
0.201
0.100
8/10
P001A
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