TS616 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS616' PDF : 36 Pages View PDF
Printed circuit board layout considerations
6
Printed circuit board layout considerations
TS616
In the ADSL frequency range, printed circuit board parasites can affect the closed-loop
performance.
The use of a proper ground plane on both sides of the PCB is necessary to provide low
inductance and a low resistance common return. The most important factors affecting gain
flatness and bandwidth are stray capacitance at the output and inverting input. To minimize
capacitance, the space between signal lines and ground plane should be maximized.
Feedback component connections must be as short as possible in order to decrease the
associated inductance which affects high-frequency gain errors. It is very important to
choose the smallest possible external components—for example, surface mounted devices
(SMD)—in order to minimize the size of all DC and AC connections.
6.1
Thermal information
The TS616 is housed in an exposed-pad plastic package. As described in Figure 55, this
package has a lead frame upon which the dice is mounted. This lead frame is exposed as a
thermal pad on the underside of the package. The thermal contact is direct with the dice.
This thermal path provides an excellent thermal performance.
The thermal pad is electrically isolated from all pins in the package. It must be soldered to a
copper area of the PCB underneath the package. Through these thermal paths within this
copper area, heat can be conducted away from the package. The copper area must be
connected to -VCC available on pin 4.
Figure 55. Exposed-pad package
Figure 56. Evaluation board
1
Side View
Bottom View
DICE
Cross Section View
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