TS925 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS925' PDF : 17 Pages View PDF
Package Mechanical Data
4 Package Mechanical Data
TS925
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com.
4.1
DIP16 Package
Plastic DIP-16 (0.25) MECHANICAL DATA
DIM.
a1
B
b
b1
D
E
e
e3
F
I
L
Z
MIN.
0.51
0.77
mm.
TYP
0.5
0.25
8.5
2.54
17.78
3.3
MAX.
1.65
20
7.1
5.1
1.27
MIN.
0.020
0.030
inch
TYP.
0.020
0.010
0.335
0.100
0.700
0.130
MAX.
0.065
0.787
0.280
0.201
0.050
14/17
P001C
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