TSA1203IFT-E View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TSA1203IFT-E' PDF : 30 Pages View PDF
TSA1203
11 Package mechanical data
Package mechanical data
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a Lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
11.1 TQFP48 package
DIM.
A
A1
A2
B
C
D
D1
D3
e
E
E1
E3
L
L1
K
MIN.
0.05
1.35
0.17
0.09
0.45
0˚
TQFP48 MECHANICAL DATA
mm.
TYP
1.40
0.22
9.00
7.00
5.50
0.50
9.00
7.00
5.50
0.60
1.00
3.5˚
MAX.
1.6
0.15
1.45
0.27
0.20
MIN.
0.002
0.053
0.007
0.0035
0.75
0.018
7˚
0˚
inch
TYP.
0.055
0.009
0.354
0.276
0.216
0.020
0.354
0.276
0.216
0.024
0.039
3.5˚
MAX.
0.063
0.006
0.057
0.011
0.0079
0.030
7˚
0110596/C
27/30
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