TSL1018 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TSL1018' PDF : 15 Pages View PDF
Package information
4
Package information
TSL1018
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Table 4.
Ref.
A
A1
A2
b
c
D
D1
D2
D3
E
E1
E2
E3
e
L
L1
k
ccc
TQFP48 ePad package mechanical data
Dimensions
Millimeters
Min.
Typ.
Max.
Min.
1.20
0.05
0.15
0.002
0.95
1.00
1.05
0.037
0.17
0.22
0.27
0.007
0.09
0.20
0.004
8.80
9.00
9.20
0.346
6.80
7.00
7.20
0.268
2.00
0.079
5.50
8.80
9.00
9.20
0.346
6.80
7.00
7.20
0.268
2.00
0.079
5.50
0.50
0.45
0.60
0.75
0.018
1.00
0°
3.5°
7°
0°
0.08
Inches
Typ.
0.039
0.009
0.354
0.276
0.217
0.354
0.276
0.217
0.020
0.024
0.039
3.5°
Max.
0.047
0.006
0.041
0.011
0.008
0.362
0.283
0.362
0.283
0.030
7°
0.003
12/15
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