TSL251RD View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL251RD' PDF : 12 Pages View PDF
TSL250RD, TSL251RD, TSL260RD, TSL261RD
LIGHT-TO-VOLTAGE OPTICAL SENSORS
MECHANICAL DATA
TAOS050K − OCTOBER 2007
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The photodiode area is typically 1.02 mm2 for the TSL250RD and TSL260RD,
and is typically 0.514 mm2 for the TSL251RD and TSL261RD.
PACKAGE D
NOTE B
TOP VIEW
2.12
+ 0.250
3.00 + 0.250
PLASTIC SMALL-OUTLINE
BOTTOM VIEW
PIN 1
6 y 1.27
PIN 1
8
y
0.510
0.330
0.50
0.25
1.75
1.35
j 2.8 TYP
CLEAR WINDOW
END VIEW
0.88 TYP TOP OF
455
SENSOR DIE
A
4.00
3.80
6.20
5.80
SIDE VIEW
5.00
4.80
5.3
MAX
DETAIL A
0.25
0.19
Pb
1.27
0.41
0.25
0.10
NOTES: A. All linear dimensions are in millimeters.
B. The center of the photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 10. Package D — Plastic Small Outline IC Packaging Configuration
The LUMENOLOGY r Company
r
r
www.taosinc.com
Copyright E 2007, TAOS Inc.
7
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