PACKAGE D
TOP VIEW
PIN 1
MECHANICAL DATA
TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L − OCTOBER 2007
Plastic Small-Outline
BOTTOM VIEW
6 y 1.27
NOTE B
PIN 1
j 2.8 TYP
8
y
0.510
0.330
CLEAR WINDOW
SIDE VIEW
END VIEW
0.50
0.25
1.75
1.35
0.88 TYP TOP OF
455
SENSOR DIE
A
4.00
3.80
6.20
5.80
5.00
4.80
5.3
MAX
DETAIL A
0.25
0.19
Pb
1.27
0.25
0.41
0.10
NOTES: A. All linear dimensions are in millimeters.
B. The center of the 1234 μm by 282 μm photo-active area is typically located in the center of the package in the long dimension and
269 μm off center in the short dimension.
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 10. Package D — Plastic Small Outline IC Packaging Configuration
The LUMENOLOGY r Company
r
Copyright E 2007, TAOS Inc.
r
www.taosinc.com
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