TSL2568CS View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL2568CS' PDF : 36 Pages View PDF
MECHANICAL DATA
TSL2568, TSL2569
LIGHT-TO-DIGITAL CONVERTER
TAOS091D − DECEMBER 2008
PACKAGE TMB-6
Six-Lead Surface Mount Device
TOP VIEW
0.694
Typ
CL
1.30
END VIEW
1.35
CL
1.90
0.0745 Typ
0.31
R 0.20
6 Pls
2.60
3.80
Photo-Active Area
0.88
TOP VIEW
PIN 1
PIN 4
BOTTOM VIEW
0.90
TYP
0.90 TYP
0.50
0.60
TYP
0.30
TYP
0.30
TYP
Pb
Lead Free
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.20 mm unless otherwise noted.
B. The photo-active area is 1388 μm by 149 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is 0.5 μm minimum of soft gold plated over a 18 μm thick copper foil pattern with a 5 μm to 9 μm nickel barrier.
E. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,
exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.
F. This package contains no lead (Pb).
G. This drawing is subject to change without notice.
Figure 20. Package T — Six-Lead TMB Plastic Surface Mount Packaging Configuration
The LUMENOLOGY r Company
r
r
www.taosinc.com
Copyright E 2008, TAOS Inc.
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