TSL25713 View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL25713' PDF : 24 Pages View PDF
TSL2571
LIGHT-TO-DIGITAL CONVERTER
TAOS117A − FEBRUARY 2011
MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 13. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C (T1)
Time above 230°C (T2)
Time above Tpeak −10°C (T3)
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
tsoak
t1
t2
t3
Tpeak
DEVICE
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260°C
Max −5°C/sec
Tpeak
T3
T2
T1
Not to scale — for reference only
Time (sec)
t3
t2
tsoak
t1
Figure 14. Solder Reflow Profile Graph
Copyright E 2011, TAOS Inc.
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www.taosinc.com
The LUMENOLOGY r Company
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