TSL2581FN View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL2581FN' PDF : 34 Pages View PDF
TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
TAOS098 − MARCH 2010
PACKAGE CS
MECHANICAL DATA
TOP VIEW
Six-Lead Chipscale Device
PIN OUT
BOTTOM VIEW
6
1
5
2
4
3
END VIEW
700 + 55
1250
400 + 50
6 y 100
BOTTOM VIEW
TYP 305
375 + 30
500
500
6 y j 210 + 30
SIDE VIEW
1750
375 + 30
500
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 25 μm unless otherwise noted.
B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).
C. The top of the photodiode active area is 410 μm below the top surface of the package.
D. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.
E. This drawing is subject to change without notice.
Figure 19. Package CS — Six-Lead Chipscale Packaging Configuration
Pb
Lead Free
Copyright E 2010, TAOS Inc.
r
The LUMENOLOGY r Company
r
28
www.taosinc.com
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