TYP1012 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TYP1012' PDF : 5 Pages View PDF
TYP512 TYP1012
Fig. 1: Maximum average power dissipation ver-
sus average on-state current.
Fig. 2: Correlation between maximum average
power dissipation and maximum allowable temper-
atures (Tamb and Tcase) for different thermal
resistances heatsink + contact.
Fig. 3: Average on-state current versus case tem-
perature.
Fig. 4: Relative variation of thermal impedance
versus pulse duration.
Zth/Rth
1
Zth(j-c)
0.1
Zth(j-a)
0.01
1E-3
1E-2
1E-1
1E+0
tp(s)
1E+1 1E+2 5E+2
Fig. 5: Relative variation of gate trigger current
versus junction temperature.
Fig. 6: Non repetitive surge peak on-state current
versus number of cycles.
3/5
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