ULC0404FC3.3C View Datasheet(PDF) - ProTek Devices.
Part Name
Description
MFG CO.
'ULC0404FC3.3C' PDF : 6 Pages View PDF
U0404 PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
C
HG
SOLDER PRINT
0.010 - 0.012 DIA.
A
D
DIE
SOLDER
BUMP
E
I
F
SOLDER PADS
SOLDER MASK
ULC0404FC3.3C
thru
ULC0404FC36C
PACKAGE DIMENSIONS
DIM MILLIMETERS
INCHES
A
0.51
F
0.15 SQ
G
0.71
H
0.99
I
0.51
0.020
0.006 SQ
0.028
0.039
0.020
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad
and outline: .xxx ± 0.05mm (± 0.002”).
3. Preferred: Using 0.1mm (0.004”) stencil.
TAPE & REEL ORIENTATION
Laser
Orientation
Line
Dual Die - 0404
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. OrderingSuffix: -T75-1, i.e., ULC0404FC05C-T75-1.
3. 8mm Paper Tape: 7 Inch Reels - 10,000 pieces per reel. Ordering Suffix: -T710-2, i.e., ULC0404FC05C-T710-2.
4. Suffix - LF = Lead-Free, i.e., ULC0404FC05C-LF-T710-2.
Outline & Dimensions: Rev 4 - 9/04, 06022
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
05168.R6 5/07
6
www.protekdevices.com
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