UPC2418AHF View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
MFG CO.
'UPC2418AHF' PDF : 14 Pages View PDF
µPC2400A Series
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF THROUGH HOLE MOUNT DEVICE
µPC2400AHF Series
Soldering Process
Wave soldering
REFERENCE
Soldering Conditions
Solder temperature: 260 ˚C or below.
Flow Time: 10 seconds or below.
Symbol
Document Name
NEC semiconductor device reliability/quality control system.
Quality grade on NEC semiconductor devices.
Semiconductor device mounting technology manual.
Semiconductor device package manual.
Guide to quality assurance for semiconductor devices.
Semiconductor selection guide.
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
12
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