UPC3206GR View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
MFG CO.
'UPC3206GR' PDF : 32 Pages View PDF
µPC3206GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesires osillation).
(3) Keep the track length of the ground pins as short as possible.
(4) A low pass filter must be attached to VCC line.
(5) A matching circuit must be externally attached to output port.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Infrared Reflow
VPS
Partial Heating
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limitNote: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limitNote: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Recommended Condition
Symbol
IR35-00-3
VP15-00-3
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of the recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
28
Data Sheet P13710EJ3V0DS00
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