UPD72001C-11 View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
MFG CO.
'UPD72001C-11' PDF : 40 Pages View PDF
µPD72001-11, 72001-A8
5. RECOMMENDED SOLDERING CONDITIONS
It is recommended to solder this product under the following conditions.
For details on the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface mount type
• µPD72001G-11-22 : 44-pin plastic QFP (10 × 10 mm)
µPD72001G-A8-22 : 44-pin plastic QFP (10 × 10 mm)
Soldering Method
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Condition
Package peak temperature: 235 °C, Time: 30 seconds MAX.
(210 °C MIN.), Number of times: 2 MAX., Number of days: 7Note
(After that, prebaking for 10 hours at 125 °C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Package peak temperature: 215 °C, Time: 40 seconds MAX.
(200 °C MIN.), Number of times: 2 MAX., Number of days: 7Note
(After that, prebaking for 10 hours at 125 °C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX.,
Number of times: 1, Preheating temperature: 120 °C MAX.
(package surface temperature), Number of days: 7Note
(After that, prebaking for 10 hours at 125 °C is necessary.)
<Precaution>
Products other than in heat-resistance trays (such as those packaged
in a magazine, taping, or non-heat-resistance tray) cannot be baked
while they are in their package.
Pin temperature: 300 °C MAX., Time: 3 seconds MAX.
(per side of device)
Recommended
Condition Symbol
IR35-107-2
VP15-107-2
WS60-107-1
—
Note The number of days the product can be stored at 25 °C, 65 % RH MAX. after the dry pack has been opened.
Caution Do not use two or more soldering methods in combination (except partial heating).
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