VG26V18165C View Datasheet(PDF) - Vanguard International Semiconductor
Part Name
Description
MFG CO.
'VG26V18165C' PDF : 27 Pages View PDF
VIS
VG26(V)(S)18165C/VG26(V)(S)18165D
1,048,576 x 16 - Bit
CMOS Dynamic RAM
Package Information 42-pin SOJ
DIM
MILLIMETERS
MIN.
NOM. MAX.
MIN.
INCHES
NOM.
MAX.
42
A
3.25
3.51
3.76 0.128 0.138 0.148
A1 2.08
---
--- 0.082
---
---
A2
2.79 REF.
0.110 REF.
b
0.38
---
0.51
0.015
--- 0.020
b1 0.38
---
0.46
0.015
--- 0.018
b2 0.66
0.71
0.81 0.026
0.028 0.032
c
0.18
---
0.33 0.007
--- 0.013
c1
0.18
0.20
0.28 0.007
0.008
0.011
e
1.27 BASIC
0.050 BASIC
D 27.18
27.31
27.43
1.070
1.075
1.080
1
E
11.05
11.18
11.30
0.435
0.440
0.445
E1 10.03 10.16 10.29 0.395 0.400 0.405
E2
9.40 BASIC
0.370 BASIC
R1 0.76
0.89
1.02 0.030
0.035
0.040
θ
3¢X
---
16¢X
3¢X
---
16¢X
A2
NOTE:
1. CONTROLLING DIMENSION : INCHES
2. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION.
MOLD PROTRUSION SHALL NOT EXCEED 0.006"(0.15) PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION.
INTERLEAD PROTRUSION SHALL NOT EXCEED 0.01"(0.25) PER SIDE.
3. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION OR
INTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE
SHOULDER WIDTH TO EXCEED b2 MAX BY MORE THAN 0.005"(0.127)
DAMBAR INTRUSION SHALL NOT REDUCE THE SHOULDER WIDTH
TO LESS THAN 0.001"(0.025) BELOW b2 MIN.
D
b2
e
b
0.007" M
22
E1 E
21
θ
0.025" MIN.
A
A1
0.004"
RAD R1
SEATING PLANE
b
b1
c1 c
BASE METAL
WITH PLATING
SECTION B-B
B
B
E2
Package Information 50(44)-pin TSOPII
MILLIMETERS
INCHES
DIM
MIN. NOM. MAX. MIN. NOM. MAX.
A
---
---
1.20
---
---
0.047
A1
0.05
---
0.15 0.002 ---
0.006
A2 0.95
1.00
1.05 0.037 0.039 0.041
b
0.30
---
0.45
0.012
---
0.018
b1
0.30
---
0.40
0.012
---
0.016
c
0.12
---
0.21
0.005
---
0.008
c1
0.11 ---
0.16 0.0045
---
0.006
D
20.82 20.95 21.08
0.820
0.825 0.830
ZD
0.875 BASIC
0.0344 BASIC
e
0.80 BASIC
0.0315 BASIC
E
11.56 11.76 11.96 0.455 0.463 0.471
E1 10.03 10.16 10.29 0.395 0.400 0.405
L
0.40
0.50
0.60 0.016 0.020 0.024
R
0.11 ---
0.25
0.004
---
0.010
R1
0.11 ---
---
0.004
---
---
NOTE:
1. CONTROLLING DIMENSION : MILLIMETERS
2. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION.
MOLD PROTRUSION SHALL NOT EXCEED 0.15mm(0.006") PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD PROTRUSION.
INTERLEAD PROTRUSION SHALL NOT EXCEED 0.25mm(0.01") PER SIDE.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSIONS/INTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD TO
BE WIDER THAN THE MAX b DIMENSION BY MORE THAN 0.13mm.
DAMBAR INTRUSION SHALL NOT CAUSE THE LEAD TO BE NARROWER
THAN THE MIN b DIMENSION BY MORE THAN 0.07mm.
50
40
36
1
11
15
D
ZD
b
4-1.60
REF.
26
A2
E1
A1
DETAIL A
RAD R1
RAD R
c
B
B
L
0 ~5
25
b
b1
SECTION B-B
c1 c
BASE METAL
WITH PLATING
DETAIL A
A
E
40 - e
0.100(0.004)
SEATING PLANE
Document:1G5-0179
Rev.1
Page 26
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