VT5363 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'VT5363' PDF : 23 Pages View PDF
VT5363
Package information
Table 7. LQFP dimensions (mm)
Reference
Min. (mm)
A
A1
A2
B
c
D
D1
D3
e
E
E1
E3
L
L1
k
W1
W2
0.050
1.350
0.300
0.090
0.450
0d
Typ. (mm)
1.400
0.370
9.00
7.000
5.600
0.800
9.000
7.000
5.600
0.600
1.000
3.5d
5.000
0.065
Max. (mm)
1.600
0.15
1.450
0.450
0.200
0.750
7d
Note: 1 Surface finish W1 is 0.07 Ra.
2 Ejectors are on 5.2 mm square for both top and bottom package.
3 On top package, only the identification for pin one is not an engraved ejector.
8.2
LOQFP package guidelines
The IC can be exposed a maximum of 2 times to an IR/Convection reflow solder process
having a temperature profile peak of no higher than 240° C.
The package/chip are lead free and is ROHS compliant.
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