VT5376 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

VT5376

Ultra-low power motion sensor for optical finger navigation and laser mice

STMicroelectronics 

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VT5376

Package mechanical data

Table 12. TQFP dimensions (mm)

Reference

Minimum (mm)

A

A1

0.050

A2

1.350

B

0.300

c

0.090

D

D1

D3

e

E

E1

E3

L

0.450

L1

k

0d

W1

W2

Typical (mm)

1.400

0.370

9.000

7.000

5.600

0.800

9.000

7.000

5.600

0.600

1.000

3.5d

5.000

0.650

Maximum (mm)

1.600

0.150

1.450

0.450

0.200

0.750

7d

Note: 1 Surface finish W1 is 0.07 Ra.

2 Ejectors are on 5.2 mm square for both top and bottom package.

3 On top package, only the pin 1 identification is not an engraved ejector.

10.1

TQFP package guidelines

The IC can be exposed a maximum of two times to an IR/Convection reflow solder process

having a temperature profile peak of no higher than 240 ° C.

The package/chip are lead free and is ROHS compliant.

For full handling guidelines, contact STMicroelectronics (document reference 7310263).

Doc ID 13939 Rev 4

29/31

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