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WED3C7410E16M400BH9C View Datasheet(PDF) - White Electronic Designs Corporation

Part Name
Description
MFG CO.
WED3C7410E16M400BH9C
WEDC
White Electronic Designs Corporation WEDC
'WED3C7410E16M400BH9C' PDF : 15 Pages View PDF
Prev 11 12 13 14 15
White Electronic Designs WED3C7410E16M-XBHX
PRELIMINARY
HITCE™ 255 BALL GRID ARRAY - BH9 PACKAGE (90Pb/10Sn SOLDER BALLS)
TOP VIEW
2.50 (0.098)
BOTTOM VIEW
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
NOTES:
1. Dimensions in millimeters and paranthetically in inches.
2. A1 corner is designated with a ball missing the array.
0.762 (0.030)
BSC
0.762 (0.030)
BSC
July 2004
Rev. 0
13
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
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