WG82567VSLAW7 View Datasheet(PDF) - Intel
Part Name
Description
MFG CO.
'WG82567VSLAW7' PDF : 34 Pages View PDF
Datasheet—82567
5.0
5.1
Package and Pinout Information
The physical characteristics of the 82567 are described in this section. The pin number
to signal mapping is indicated in Section 5.4.
Package Information
The package used for the 82567 is an 56-pin QFN package. The Epad size is option
number 4.
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Figure 4.
5.2
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82567 Mechanical Drawing
Thermal
The thermal resistance from junction to case, JC, is 6.1 C/Watt. The thermal resistance
from junction to ambient, JA, is as follows:
Note:
Air Flow (m/s)
0
1
2
3
No heat sink required.
Maximum TJ
127.1
122.1
119.3
117.5
ja (°C/Watt)
26.0
23.7
22.4
21.6
29
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