XE014JS-ITR View Datasheet(PDF) - Xecom
Part Name
Description
MFG CO.
'XE014JS-ITR' PDF : 11 Pages View PDF
XE014JS Soldering Instructions
Because of its Hybrid construction, the XE014JS PLCC DAA’s are subject to damage if over-exposed to heat during
solder reflow operations. Following the soldering instructions below will ensure that the process of soldering the
module to the board does not damage the DAA.
Maximum Temperature 220O C
Maximum Time at 220O C 20 Seconds
Maximum Time above Eutectic (180O C) 90 Seconds
Maximum Preheat Dwell Time 180 Seconds
Maximum Recommended Solder Profile
220O C
180O C
150O C
180 sec
max
-20 sec-
max
----- 90 sec max -----
Notes:
Because of their large black bodies, Xecom’s XE014JS DAA modules must not be exposed to direct Infrared Ray
(IR) heating. If your process includes direct IR heating, you must shield the PLCC DAA module from the infrared
rays.
Xecom’s PLCC DAA modules should be exposed to no more than one reflow cycle.
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XE014JS
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