ZICM357P2-2 View Datasheet(PDF) - California Eastern Laboratories.
Part Name
Description
MFG CO.
ZICM357P2-2
California Eastern Laboratories.
'ZICM357P2-2' PDF : 16 Pages View PDF
MeshConnect™ EM357 Module
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp Up Rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
Soak Time
TLiquidus
D Time above TL
Tpeak
E Time within 5º of Tpeak
Time from 25º to Tpeak
D Ramp Down Rate
200ºC
60-120 sec
217ºC
60-150 sec
250ºC
20-30 sec
8 min max
6ºC/sec max
N N Pb-Free Solder Paste
E IG Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet
M the appropriate IPC Specification. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated
S Terminations Section.
M E Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be
O D easily removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
C board and the module. The combination of soldering flux residuals and encapsulated water could lead to
E W short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
E housings, which is not accessible for post-washing inspection. The solvent could also damage any
R stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
T N The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
O R Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
N O • Proper alignment and centering of the module over the pads
F • Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
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